AUTOMATIC
SMD ASSEMBLY
PCB ASSEMBLY IN MEDIUM VOLUME PRODUCTION. WE CAN ALSO HANDLE LARGER PRODUCTION AND PROTOTYPE ASSEMBLY. WE USE YAMAHA AUTOMATIC ASSEMBLY MACHINES WITH HIGH ASSEMBLY PRECISION AND CAMERA FOCUSING.
WITH YEARS OF RELEVANT EXPERIENCE
LEVEL
EQUIPMENT
MACHINE CAPACITIES
PRECISION
AUTOMATIC ASSEMBLY
CAPACITY
2–3 mil.
ASSEMBLED PCBs/YEAR
WE HAVE
3 PRODUCTION LINES
PCB LOADER
SCREEN PRINTING
3D
SPI
2 AUTOMATIC ASSEMBLY MACHINES
REMELTING FURNACE
3D
AOI
PCB UNLOADER
AUTOMATIC ASSEMBLY
WE USE YAMAHA MACHINES FOR ASSEMBLY. THESE MACHINES ARE RENOWNED FOR THEIR HIGH ASSEMBLY PRECISION AND CAMERA FOCUSING. THE ASSEMBLY SPEED IS A MINIMUM OF 30,000 COMPONENTS PER HOUR.
AUTOMATIC OUTPUT INSPECTION
WE PERFORM PRE-DISPATCH TESTING USING VARIOUS DEGREES OF ELECTRIC TESTERS, WHETHER THEY ARE TESTERS PROVIDED BY THE CUSTOMER OR OUR OWN PRODUCTION. BASED ON THE CLIENT’S REQUIREMENTS, IT IS POSSIBLE TO INSTALL FIRMWARE DURING OUTPUT INSPECTION AND THEN REVIVE THE PRODUCT. AUTOMATIC OPTICAL INSPECTION TAKES PLACE DURING IN-PROCESS CONTROL, SMD ASSEMBLY, AND OUTPUT INSPECTION.
APPLICATION OF SOLDERING PASTE BY AUTOMATIC PRINTING
WE PRINT WITH A HIGH-QUALITY LASER STENCIL ON A DEK SCREEN PRINTING DEVICE WITH FULLY AUTOMATIC OPERATION AND 2D OPTICAL PRINT INSPECTION. OUR VERSION OF SCREEN PRINTING ALLOWS PRINTING OF UP TO 500 × 450 MM FORMATS WITH A WIDE RANGE OF ADJUSTABLE PARAMETERS.
wave soldering
This is soldering in a tin bath with a wave of molten tin solder created.
The method is used for soldering PCBs equipped with THT components with leads.
CLEANING
ASSEMBLED PCBs
WE CLEAN ASSEMBLED PCBs USING A CZECH-MADE AUTOMATIC CLEANING DEVICE – THE DCT INJECT 388 CRD WITH ACTIVE FILTRATION AND SEPARATE WATER MAINTENANCE. FOR APPLICATIONS THAT REQUIRE ULTRASOUND CLEANING, WE USE A REECO ULTRASOUND CLEANER, WHICH IS FILLED WITH A HIGH-QUALITY, EFFICIENT AND MILD LIQUID DESIGNED FOR PCBs BY HENKELL.
REMELTING OF REFLOW SOLDERING PASTE
REMELTING OF SOLDERING PASTE VIA THE REFLOW METHOD IS CARRIED OUT USING A HELLER 1707 MKIII MACHINE. THE REFLOW FURNACE ALLOWS THE INDIVIDUAL CONFIGURATION OF 14 HEATING CHAMBERS WITH PRECISE TEMPERATURE SETTINGS, GUARANTEEING THE HIGHEST QUALITY FOR SOLDERING ASSEMBLED COMPONENTS. IT IS POSSIBLE TO SET REMELTING PROFILES IN THE REFLOW FURNACE FOR USED LEADED AND UNLEADED SOLDERING PASTES, COMPONENTS, ADHESIVES, AND MULTI-LAYER PCBs.
